Electronic articles containing a fluorinated poly(arylene ether) dielectric
AssigneeRaychem Corporation
InventorsFrank W. Mercer, Timothy D. Goodman, Aldrich N. K. Lau, Lanchi P. Vo, Richard C. Sovish
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Abstract
An electronic article such as a multichip module or an integrated circuit chip has a multilayer interconnect with multiple layers of conductive material and a dielectric material made of a fluorinated poly(arylene ether) having a repeat unit such as ##STR1##
Claims31
A multichip module comprising a substrate, a plurality of semiconductor chips carried on the substrate, and a multilayer interconnect which connects the semiconductor chips and comprises plural layers of conductive material and plural layers of a dielectric material, wherein the dielectric material comprises a fluorinated poly(arylene ether) comprising a repeat unit of the structure ##STR30## wherein each --A is independently --F, --Cl, --Br, --CF.sub.3, --CH.sub.3, --CH.sub.2 CH.dbd.CH.sub.2, or --C.sub.6 H.sub.5 ;
- p is 0, 1, or 2;
- --Z-- is a direct bond, --C(CH.sub.3).sub.2 --, --C(CF.sub.3).sub.2 --, --O--, --S--, --SO.sub.2 --, --CO--, --P(C.sub.6 H.sub.5)--, C(CH.sub.3)(C.sub.6 H.sub.5), --C(C.sub.6 H.sub.5).sub.2 --, --(CF.sub.2).sub.1-6 --, or ##STR31## wherein --Y-- is --O-- or a direct bond;
- and m is 0, 1, or 2;
- each --X is independently --H, --Cl, --Br, --CF.sub.3, --CH.sub.3, --CH.sub.2 CH.dbd.CH.sub.2, or --C.sub.6 H.sub.5 ;
- q is 0, 1, or 2;
- and n is 1 or 2.
An article comprising an integrated circuit chip and a multilayer interconnect on the chip, the multilayer interconnect comprising plural layers of conductive material and plural layers of a dielectric material, wherein the dielectric material comprises a fluorinated poly(arylene ether) comprising a repeat unit of the structure ##STR39## wherein each --A is independently --F, --Cl, --Br, --CF.sub.3, --CH.sub.3, --CH.sub.2 CH.dbd.CH.sub.2, or --C.sub.6 H.sub.5 ;
- p is 0, 1, or 2;
- --Z-- is a direct bond, --C(CH.sub.3).sub.2 --, --C(CF.sub.3).sub.2 --, --O--, --S--, --SO.sub.2 --, --CO--, --P(C.sub.6 H.sub.5)--, C(CH.sub.3)(C.sub.6 H.sub.5), --C(C.sub.6 H.sub.5).sub.2 --, --(CF.sub.2).sub.1-6 --, or ##STR40## wherein --Y-- is --O-- or a direct bond;
- and m is 0, 1, or 2;
- each --X is independently --H, --Cl, --Br, --CF.sub.3, --CH.sub.3, --CH.sub.2 CH.dbd.CH.sub.2, or --C.sub.6 H.sub.5 ;
- q is 0, 1, or 2;
- and n is 1 or 2.
An integrated circuit chip having thereon a protective layer, wherein the protective layer comprises a fluorinated poly(arylene ether) comprising a repeat unit of the structure ##STR46## wherein each --A is independently --F, --Cl, --Br, --CF.sub.3, --CH.sub.3, --CH.sub.2 CH.dbd.CH.sub.2, or --C.sub.6 H.sub.5 ;
- p is 0, 1, or 2;
- --Z-- is a direct bond, --C(CH.sub.3).sub.2 --, --C(CF.sub.3).sub.2 --, --O--, --S--, --SO.sub.2 --, --CO--, --P(C.sub.6 H.sub.5)--, C(CH.sub.3)(C.sub.6 H.sub.5), --C(C.sub.6 H.sub.5).sub.2 --, --(CF.sub.2).sub.1-6 --, or ##STR47## wherein --Y-- is --O-- or a direct bond;
- and m is 0, 1, or 2;
- each --X is independently --H, --Cl, --Br, --CF.sub.3, --CH.sub.3, --CH.sub.2 CH.dbd.CH.sub.2, or --C.sub.6 H.sub.5 ;
- q is 0, 1, or 2;
- and n is 1 or 2.
A circuit board comprising a substrate having on a surface thereof a conductor pattern, wherein the substrate comprises a fluorinated poly(arylene ether) comprising a repeat unit of the structure ##STR53## wherein each --A is independently --F, --Cl, --Br, --CF.sub.3, --CH.sub.3, --CH.sub.2 CH.dbd.CH.sub.2, or --C.sub.6 H.sub.5 ;
- p is 0, 1, or 2;
- --Z-- is a direct bond, --C(CH.sub.3).sub.2 --, --C(CF.sub.3).sub.2 --, --O--, --S--, --SO.sub.2 --, --CO--, --P(C.sub.6 H.sub.5)--, C(CH.sub.3)(C.sub.6 H.sub.5), --C(C.sub.6 H.sub.5).sub.2 --, --(CF.sub.2).sub.1-6 --, or ##STR54## wherein --Y-- is --O-- or a direct bond;
- and m is 0, 1, or 2;
- each --X is independently --H, --Cl, --Br, --CF.sub.3, --CH.sub.3, --CH.sub.2 CH.dbd.CH.sub.2, or --C.sub.6 H.sub.5 ;
- q is 0, 1, or 2;
- and n is 1 or 2.
Dependencies are inferred from the claim text.