System for connecting integrated circuit dies to a printed wiring board

An improved solderless system for electrically and mechanically connecting at least one integrated circuit die to a printed wiring board, wherein said die includes a pattern of bond pads along the periphery of one of its sides, comprising:

• a fanout interface means including a sheet of insulating material having first and second interconnected arrays of contact pads on first and second sides, respectively, said first side of said sheet integrally contacting and substantially covering said side of said die, and the pads of said first array being electrically connected with said pattern of bond pads, and said second array having an area type pitch;
• a connecting interface means including an array of resilient electrical connector means for electrically connecting said second array of said fanout interface means to another array of contact pads electrically connected to the printed wiring board, and a section of insulating, compliant sheet material for holding said connector means;
• means for compressing the resilient electrical connector means into engagement between said second and another array of contact pads, and
• a hermetic sealing means for insulating all exposed metallization of said die from moisture.

An improved solderless system for electrically and mechanically connecting at least one integrated circuit die to a printed wiring board, wherein the die includes a pattern of bond pads along the periphery of one of its sides, comprising:

• a fanout interface means including a sheet of insulating material having first and second arrays of contact pads on first and second sides, respectively, the first side of said sheet integrally contacting and substantially covering the bond pad side of the integrated circuit die, the pads of said first array being registered with said pattern of bond pads and electrically connected thereto, and said second array having an area type array;
• a connecting interface means including an array of resilient electrical connector means for electrically connecting said second array of said fanout interface means to an array of contact pads on the printed wiring board, and a section of insulating, compliant sheet material for holding said connector means;
• a support plate assembly mounted over said printed wiring board and having an aperture surrounding said array of contact pads electrically connected to said board for receiving a connecting interface means and said fanout interface means of said die in stacked relationship;
• means for both compressing the resilient electrical connector means into engagement between said second and other array of contact pads connected to said board, and for conductively transferring heat from said die to the ambient atmosphere, and
• a hermetic sealing means including a passivation coating applied over all exposed metallization on said die for protecting said metallization from moisture and obviating the need for containing the integrated circuit die in a separate package housing.

An improved system for electrically interconnecting a plurality of integrated circuit dies into a sub-assembly and for electrically and mechanically connecting said subassembly to a printed wiring board, comprising:

• a fanout interface means for each of said dies, each of which includes a sheet of insulating material having first and second interconnected arrays of contact pads on first and second sides, respectively, said first array being connected to the bond pads of said die;
• an interconnection substrate having a first pattern of contact pads on a first side that is registerable with the second array of contact pads of each of said fanout interface means, a plurality of internal conductors for interconnecting said dies into a subassembly, and a second pattern of contact pads on a second side that is registerable with a set of contact pads mounted directly on the printed wiring board;
• at least one first connecting interface means disposed between said dies and said first side of said substrate and having an array of resilient electrical connector means for electrically connecting said second array of pads of said fanout interface means to said first pattern of contact pads on said substrate;
• a second connecting interface means disposed between said substrate and said printed wiring board and having an array of resilient electrical connector means for electrically connecting said second pattern of contact pads to said set of printed wiring board contact pads, and
• means for compressing the resilient electrical connector means of said first and second connecting interface means into conductive engagement between said second array and first pattern of contact pads and said second pattern of contact pads and said printed wiring board contact pads.

An improved solderless system for electrically and mechanically connecting at least one integrated circuit die to a printed wiring board, wherein sid die having a side that includes a pattern of bond pads along its edges, comprising:

• a fanout interface means including a sheet of insulating material having first and second interconnected arrays of contact pads on first and second sides, respectively, said first side of said sheet material integrally contacting and substantially covering said bond pad side of said die, and first array of pads being connected to said bond pads of said die, and said second array of bond pads being arranged in an area array;
• a package housing having a cavity on one side for receiving an integrated circuit die, an internal contact pad array on the surface of said cavity that is registerable with the contact pad array of the die, and an external area-type contact array on an opposite side of said housing;
• a connecting interface means disposed between said fanout interface means and said cavity and including an array of resilient electrical connector means for electrically connecting said second array of pads of said fanout interface means with sid internal contact pads of such housing, and
• lid means affixed over the cavity in the package housing for compressing the resilient electrical connector means into engagement between said fanout interface contact pads and cavity contact pads for hermetically sealing said package housing.