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US 5,106,453 AGranted
MOCVD method and apparatus
AssigneeAT&T Bell Laboratories
InventorsJohn W. Benko, Jerome Levkoff, Daniel C. Sutryn, Montri Viriyayuthakorn
Life of this patent
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Abstract
In an MOCVD reactor, gases are channeled around the periphery of a baffle plate (15) so as to flow radially inwardly along a slotted injection plate (16). The slots (22) in the injection plate extend radially and are of non-uniform width so as to compensate for a non-uniform rate of deposition. The resultant flow over a rotating heated substrate (17) gives a more uniform deposit of epitaxially grown material.
Claims14
A method for making a semiconductor device comprising the steps of:
- forming a substrate of a monocrystalline semiconductor compound selected from the group consisting of group III-V compounds and group II-VI compounds;
- heating the substrate;
- epitaxially growing a layer on a first surface of the substrate comprising the step of exposing the heated substrate to a gas comprising a metalorganic compound and a second compound;
- said metalorganic compound comprising an organic component and a metal selected from the group consisting of groups III and II of the periodic table;
- the second compound comprising an element selected from the group consisting of groups V and VI of the periodic table;
- said exposure causing a reaction of the metalorganic compound and the second compound which results in the epitaxial growth on a surface of the substrate of a semiconductor compound comprising a metal which originally constituted part of the metalorganic compound and an element which originally constituted part of the second compound, characterized by the steps of:
- providing an injection plate that is substantially parallel to the first surface of the substrate;
- the injection plate having first and second parallel surfaces and an outer periphery, the second surface facing the first surface of the substrate;
- providing in the injection plate at least one slot communicating with the first and second surfaces, the slot having a non-uniform width which is narrower at a region relatively near the center of the plate than at a region relatively near the periphery of the injection plate;
- rotating the substrate during deposition;
- and directing the gas to flow over the first surface of the injection plate in a substantially radially inward direction from a peripheral part of the injection plate toward the center of the injection plate, whereby at least part of the gas is transmitted through said slot before reaching the first surface of the substrate.
8 more elements
A method for making a semiconductor device comprising the steps of:
- heating a crystal semiconductor substrate;
- rotating the substrate;
- locating a flat injection plate generally parallel to an upper surface of the substrate;
- directing a gas comprising a metalorganic component and a second component over a surface of the injection plate opposite the substrate;
- said directing step comprising the step of causing the gas to flow radially inwardly toward the center of the injection plate;
- causing the gas to flow through the injection plate at a rate which is higher at a region relatively far from the center of the injection plate than at a region relatively near the center of the injection plate;
- the metalorganic and second components reacting with the substrate to form an epitaxial layer on the upper surface of the substrate.
4 more elements
Dependencies are inferred from the claim text.