Abrasion-type splitting unit

An abrasion-type splitting unit for splitting an ingot made of hard material into a plurality of wafers, comprising:

• at least two identical, horizontal and parallel wire guide cylinders arranged facing one another and capable of synchronous rotation;
• a supply coil;
• a take-up coil;
• a wire which is capable of being unwound from said supply coil, wound under tension around said at least two wire guide cylinders to form at least one set of cutting wires and wound on said take-up coil;
• a bracket for carrying an ingot, said bracket having a center of gravity and including means for guiding said bracket along a rail member;
• an actuator for vertically lifting said bracket along a vertical axis which passes substantially through the center of gravity of said bracket in order to press the ingot against the at least one set of cutting wires;
• and
• a support member comprising a one-piece structure including a base, two upper lateral flanges and rail members, said at least two wire guide cylinders being located between said two upper lateral flanges, with opposite end portions of each of said at least two wire guide cylinders being supported by one of said two upper lateral flanges, said two lateral flanges extending substantially perpendicular to said at least two wire guide cylinders and symmetrical to a median vertical plane, and said rail members cooperating with said means for guiding for permitting vertical movement of said bracket.