Electronic package for high density applications

An electronic package comprising:

• a first circuitized substrate including a plurality of electrical conductors located on a surface thereof in a predetermined pattern;
• a frame member removably positioned on said first circuitized substrate in a manner so as to be precisely aligned relative to said predetermined pattern of said conductors;
• a semiconductor device electrically coupled to said first circuitized substrate;
• a second circuitized substrate including a common circuitized section and a plurality of individual circuitized sections electrically and mechanically connected to said common section, each of said individual circuitized sections securedly positioned and precisely aligned on said frame member and including a plurality of electrical contacts located thereon in a pre-established pattern and adapted for engaging respective ones of said electrical conductors of said first circuitized substrate, said common section adapted for thermally expanding relative to said plurality of circuitized sections, said semiconductor device fixedly positioned on said common circuitized section and electrically connected thereto, said semiconductor device coupled to said first circuitized substrate through said second circuitized substrate;
• pressure exertion means including a plurality of exertion members for exerting a predetermined pressure against said individual circuitized sections of said second circuitized substrate to cause said electrical contacts thereon to engage said respective ones of said electrical conductors of said first circuitized substrate;
• and
• means for retaining said plurality of exertion members against said individual circuitized sections to cause said exertion members to exert said pressure against said individual circuitized sections.