Two-shot molded article for use in circuit formation

An integrally molded article for use in circuit formation formed by a two-shot injection molding process wherein a secondary thermoplastic resin composition having a melt viscosity of 200 P. or below measured at 310.degree. C. at a shear rate of 1,200 sec..sup.-1 comprising an anisotropic melt-forming polyester having a weight average molecular weight of 10,000 or below and a particulate inorganic filler in a concentration not exceeding 80 percent by weight of said composition selected from the group consisting of the Group II elements of the periodic table, and oxides, sulfates, phosphates, silicates and carbonates thereof, aluminum, silica, tin, antimony, bismuth and oxides thereof, palladium chloride, glass fiber, milled glass fiber, finely powdered glass, and mixtures of the foregoing, is injection molded about preselected portions not intended to bear a circuit of a previously molded primary thermoplastic resin composition which has been pretreated for plating so as to achieve excellent adhesion between the primary thermoplastic resin composition and the secondary thermoplastic resin composition.