Printed circuit and fabrication of same

A printed circuit, comprising:

• a first layer comprising a first material;
• a second layer comprising a second material more flexible than said first material, said second layer being bonded to said first layer along part of a surface of said second layer, such that respectively more and less flexible portions are formed with a first boundary defined therebetween;
• and
• a first member, distinct from said first and second layers and more flexible than said less flexible portion, extending from the first boundary into said more flexible portion for ameliorating stress at the first boundary, wherein the portion of said first member extending from the first boundary into said more flexible portion is smaller than said more flexible portion.

A printed circuit, comprising:

• a first layer of a first material;
• a second layer of a second material more flexible than said first material, said second layer being bonded to said first layer along part of a surface of said second layer, such that respectively more and less flexible portions are formed with a first boundary defined therebetween;
• and
• a first member distinct from said first and second layers and composed of a third material more flexible than said first material, extending from the first boundary into said more flexible portion for ameliorating stress at the first boundary, wherein the portion of said first member extending from the first boundary into said more flexible portion is smaller than said more flexible portion and is at least partially free of said more flexible portion.

A multilayer printed circuit, comprising:

• first and second layers, each comprising substantially dielectric material, said first layer having an opening therethrough for which said second layer does not have a corresponding opening therethrough, the opening defining a portion of a future boundary between more flexible and less flexible portions of said printed circuit in its final condition, wherein
• said second layer bears at least one conductive path and said second layer is more flexible than said first layer;
• disposed between and bonded to said first and second layers, a third layer comprising substantially chemically nonpermeable material for chemically isolating said at least one conductive path against damage as the result of subsequent treatment of said printed circuit;
• a fourth layer comprising substantially dielectric material and less flexible than said second layer, said fourth layer having an opening therethrough for which said second layer does not have a corresponding opening therethrough, the opening defining a portion of a future boundary between more flexible and less flexible portions of said printed circuit in its final condition;
• and
• disposed between and bonded to said second and fourth layers, a fifth layer comprising substantially chemically nonpermeable material for chemically isolating said at least one conductive path against damage as the result of subsequent treatment of said printed circuit.

A multilayer material, comprising:

• a first layer comprising a first material;
• a second layer comprising a second material more flexible than said first material, said second layer being bonded to said first layer along part of a surface of said second layer, such that respectively more and less flexible portions of the multilayer material are formed with a first boundary defined therebetween;
• and
• a first member distinct from said first and second layers extending from between said first and second layers at the first boundary into said more flexible portion for ameliorating boundary stress, wherein the portion of said first member extending from the first boundary into said more flexible portion is smaller than said more flexible portion.