Scanning electron microscope for observation of cross section and method of observing cross section employing the same

A cross section cutting and observing method employing a scanning electron microscope for cross section observation for directing an electron beam to a cross section of a semiconductor wafer to observe a state of the cross section of said semiconductor wafer, said method comprising the steps of:

• moving a sample plate having said semiconductor wafer placed thereon to and around a region where the cross section observation is to be carried out;
• after moving said sample plate, scanning an ion beam at and around said region where said cross section observation is carried out to generate secondary electrons from said semiconductor wafer, and detecting said generated secondary electrons to set a position where said cross section observation is to be carried out;
• scanning with an ion beam said set position where said cross section observation is to be carried out, to cut a cross section;
• when cutting said cross section, scanning with said electron beam said cross section to be cut and detecting electrons to be reflected from said semiconductor wafer, to observe a process of cutting said cross section;
• and
• scanning with said electron beam the cross section cut by said cross section cutting step to generate secondary electrons from said semiconductor wafer, and detecting said secondary electrons to observe the state of the cross section scanned with said electron beam.

A method of cutting a cross-section of a semiconductor wafer, comprising the steps of:

• scanning an ion beam on a predetermined area of said wafer for cutting a cross section therein;
• simultaneously therewith, scanning an electron beam on said cross section being cut and detecting electrons reflected from said semiconductor wafer;
• and
• based upon said reflected electrons detected during the preceding step, providing an indication of said cross-section being cut.