Electrical connector using shape memory alloy coil springs

A high density electrical connector of a type wherein contact pads on close center spacings extending on first printed circuit boards are interconnected to contact pads on a second printed circuit board to form circuit functions, the said connector comprising a means to guide and position the first circuit board relative to the second circuit board and to hold said boards relatively together with the said circuit pads in alignment, a connector body including a flexible film containing circuit pads on rows and centers compatible with the circuit pads of the first and second boards with means holding said films proximate to said pads, said means including grooves in the said connector containing canted coil springs of a cross-sectional dimension and pitch to effect a displacement of the pads of said film into engagement with the pads of said boards, the said canted coil spring being formed of a shape memory alloy material operable over a temperature variation to be rendered into a weak condition to facilitate insertion and withdrawal of the said first board relative to the said second board in said connector and in a second condition to provide normal forces of engagement between the contact pads of said first and second board and said film to provide a stable low resistance interface therebetween, said connector including a hollow body which is sealed at each end and supplied at each end with means to provide a fluid to selectively heat or cool said housing and said springs to alter the condition of said springs.