Compact package for electronic module
AssigneeDallas Semiconductor Corporation
InventorsMichale L. Bolan, Robert D. Lee, James P. Manitt
Life of this patent
Estimating the term…
Loading patent…
AssigneeDallas Semiconductor Corporation
InventorsMichale L. Bolan, Robert D. Lee, James P. Manitt
Estimating the term…
A very compact package for an electronic data module, which includes battery-backed memory. A two-part metal container is used, which has two shallow concave pieces which fit together. The integrated circuit (in a low-height package, such as a flat-pack or SOIC) is mounted on a very small flexible printed circuit board, which fits inside the container. Laterally spaced from the integrated circuit, on the other end of the small flexible board, the board end is sandwiched between a battery and a piece of elastic conductive material (such as conductive plastic foam). Thus, the battery is connected between one face of the container and a power conductor on the board. The piece of elastic conductive material makes contact between a data trace on the board and the other face of the container. Another trace on the board makes contact directly to the container face on which the battery's ground terminal is connected. Thus, simple wiring on the small board, using through-hole vias, suffices to route power, ground, and data lines to the integrated circuit, while providing a sealed durable package with two external contacts.
An electronic module, comprising:
An electronic module, comprising:
Dependencies are inferred from the claim text.