Barrier materials useful for packaging
AssigneeE. I. Du Pont de Nemours and Company
InventorsGedeon I. Deak, Scott C. Jackson
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Abstract
Multilayer structures suitable for food packaging is provided, wherein barrier layers of SiO and SiO.sub.2 are successively vacuum deposited on a resin substrate such as PET film. This combination of silicon oxide layers provides economical, color-free, microwaveable packaging. Barrier properties of the packaging after retorting can be improved by incorporation of a dopant of metallic material in the SiO.sub.2 layer.
Claims19
A multilayer structure comprising a resin substrate of polyester or polyamide, a vacuum deposited layer of SiO of about 10 to 75 nm thickness on said substrate, and a vacuum deposited layer of SiO.sub.2 of at least about 20 nm thickness on said SiO layer.
A process for forming a barrier structure from a resin substrate of polyester or polyamide polymer comprising vacuum depositing a layer of SiO of about 10 to 75 nm thickness on said resin substrate and vacuum depositing a layer of SiO.sub.2 of at least about 20 nm thickness on said SiO layer, the resultant multilayer structure having an oxygen transmission rate (OTR) of less than about 7 cc/m.sup.2 Day Atm.
Dependencies are inferred from the claim text.