Method of manufacturing heat pipe semiconductor cooling apparatus
AssigneeFurukawa Electric Co., Ltd.
InventorTakashi Murase
Life of this patent
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Abstract
In a method of manufacturing a heat pipe semiconductor cooling apparatus of this invention, one or a plurality of through holes are formed in a metal elongated member, and the metal elongated member is cut into a predetermined length to obtain a desired metal block. End portions of the through holes of the metal block are sealed, these parts are bonded by heating to constitute a heat-absorbing portion, and one end portion of a heat pipe is inserted in each through hole. Alternatively, after one end portion of a heat pipe is inserted in each through hole, an end portion of the through hole is sealed, and these parts are bonded by heating to constitute a heat-absorbing portion. Fins are mounted on the other end portions of the heat pipes by press fitting to constitute a radiating portion.
Claims21
A method of manufacturing a heat pipe semiconductor cooling apparatus, comprising the steps of:
- forming at least one through hole in a metal elongated member, each said at least one through hole having first and second open ends;
- cutting said metal elongated member to have a predetermined length to obtain a metal block;
- providing at least one heat pipe, each said at least one heat pipe having a first and a second end portion;
- placing said metal block on a refractory flat plate to seal the first open end of said at least one through hole;
- inserting a low temperature solder and the first end portion of a respective at least one heat pipe in each of the at least one through holes;
- bonding said first end portion of the at least one heat pipe to the metal block by heating and melting the low temperature solder, thereby forming a heat-absorbing portion;
- and
- mounting fins on the second end portion of said at least one heat pipe to form a radiating portion.
A method of manufacturing a heat pipe semiconductor cooling apparatus, comprising the steps of:
- forming at least one through hole in a metal elongated member, each at least one through hole having first and second open ends;
- cutting said metal elongated member to have a predetermined length to obtain a metal block having a predetermined shape;
- sealing the first open end of the at least one through hole;
- providing at least one heat pipe, each of said at least one heat pipes having a first and a second end portion;
- inserting a low temperature solder and the first end portion of a the at least one heat pipe in the at least one through hole,
- bonding the first end portion of the at least one heat pipe to the metal block by heating and melting the low temperature solder, thereby forming a heat-absorbing portion;
- and
- mounting fins on the second end portion of the at least one heat pipe to form a radiating portion on said at least one heat pipe.
Dependencies are inferred from the claim text.