Chip mounting apparatus
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsTateo Ando, Akira Kabeshita
Life of this patent
Estimating the term…
Abstract
A chip mounting apparatus includes an X-Y robot having a chip mounting head and a substrate position recognizing camera both positioned in an upper arm of the robot apparatus. The chip mounting head is for holding a chip to be mounted. A substrate holding member is for holding a chip mounting substrate and is disposed below the robot. A chip position recognizing camera is also disposed below the robot. The positional relationship between the chip mounting head and the substrate position recognizing camera is equivalent to the positional relationship between a chip mounting position of the chip mounting substrate and the chip position recognizing camera.
Claims2
A chip mounting apparatus comprising:
- an X-Y robot having an arm member which is movable in X and Y directions relative to a mounting position of the X-Y robot;
- a chip mounting head and a substrate position recognizing camera respectively fixed to the arm member of the X-Y robot;
- a substrate holding member for holding a chip mounting substrate, the substrate holding member being disposed such that a chip mounting position of the chip mounting substrate is spaced from and opposed to the substrate position recognizing camera;
- and
- a chip position recognizing camera disposed spaced from and opposed to the chip mounting head,
- wherein a positional relationship between the chip mounting head and the substrate position recognizing camera is equivalent to a positional relationship between the chip mounting position of the chip mounting substrate and the chip position recognizing camera, wherein the chip mounting head is in a field of view of the chip position recognizing camera at the same time the chip mounting position of the chip mounting substrate is in a field of view of the substrate position recognizing camera.
Dependencies are inferred from the claim text.