Method of drilling of through-holes in printed circuit board panels
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsMorio Gaku, Hidenori Kimbara
Life of this patent
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Abstract
A method of drilling a through-hole in a printed circuit board panel, which comprises placing a water-soluble lubricant sheet on one surface or each of two surfaces of a printed circuit board panel and drilling a through-hole through the printed circuit board panel, the water-soluble lubricant sheet being composed of a mixture of 20 to 90% by weight of a polyethylene glycol having a weight average molecular weight of not less than 10,000 with 10 to 80% by weight of a water-soluble lubricant and having a thickness of 0.05 to 3 mm.
Claims5
A method of drilling a through-hole in a printed circuit board panel, which comprises placing a water-soluble lubricant sheet on one surface or each of two surfaces of a printed circuit board panel and drilling a through-hole through the printed circuit board panel, the water-soluble lubricant sheet being composed of a mixture of 20 to 90% by weight of a polyethylene glycol having a weight average molecular weight of not less than 10,000 with 10 to 80% by weight of a water-soluble lubricant and having a thickness of 0.05 to 3 mm.
Dependencies are inferred from the claim text.