Method of bonding metals to ceramics
AssigneeArch Development Corporation
InventorVictor A. Maroni
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Abstract
A method of forming a composite by providing a ceramic capable of having zero electrical resistance and complete diamagnetism at superconducting temperatures, bonding a thin layer of Ag, Au or alloys thereof with the ceramic. Thereafter, there is bonded a first metal to the ceramic surface at a temperature less than about 400.degree. C., and then a second metal is bonded to the first metal at a temperature less than about 400.degree. C. to form a composite wherein the first metal is selected from the class consisting of In, Ga, Sn, Bi, Zn, Cd, Pb, Ti and alloys thereof and wherein the second metal is selected from the class consisting of Al, Cu, Pb and Zn and alloys thereof.
Claims6
A method of forming a composite comprising the steps of:
- providing a ceramic capable of having zero electrical resistance and complete diamagnetism at superconducting temperatures, bonding a layer of Ag, Au or alloys thereof with the ceramic, pressure bonding a first metal of In or an alloy thereof the to layer of Ag, Au or alloys thereof at a temperature less than the melting point of the In or In alloy, bonding a second metal to the In or In alloy to form a composite wherein the second metal is selected from the class consisting of Al, Cu, Pb and Zn and alloys thereof.
Dependencies are inferred from the claim text.