Method and apparatus for pressure sticking a thin film to a base plate
AssigneesSomar Corporation, Hitachi Techno
InventorsFumio Hamamura, Yukio Oka
Life of this patent
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AssigneesSomar Corporation, Hitachi Techno
InventorsFumio Hamamura, Yukio Oka
Estimating the term…
Apparatus and method for pressure and heat sticking a thin film to a base plate. The thin film and a base plate on a film like carrier are introduced into a vacuum chamber having upper and lower contact members for compressing the thin film, base member and carrier into a stratified body. The thin film and base plate are held separate from one another in the chamber. The lower contact member moves upward to contact the carrier and base plate and to compress the stratified body between it and the upper contact member. The upper contact member is convex in shape and made of an elastic material so that the contact pressure on the thin film and base plate starts near the center and spreads toward the periphery resulting in improved sticking of thin film to the base plate with no air bubbles and no wrinkling. The pressure is applied in a vacuum or reduced atmospheric pressure and heat is simultaneously applied. A further compression in the air at atmospheric pressure is carried out by a heat and pressure roller.
In a process for producing a printed circuit, a method of pressure and heat sticking a dry, thin film to a base plate, comprising the steps of:
Apparatus for automatically pressure and heat sticking a dry, thin film to a base plate, the apparatus comprising:
Apparatus for automatically pressure and heat sticking a dry, thin film to base plates, the apparatus comprising:
Apparatus for automatically pressure and heat sticking a dry, thin film to base plates, the apparatus comprising:
In an automated process for producing a plurality of printed circuits a method for adhering a dry, thin film to flat base plates thru the application of pressure thereto, the improvement comprising, mechanically applying pressure to a dry thin film and a base plate in reduced pressure atmosphere of a vacuum chamber in accordance with a sequence of contact pressure being applied to the thin film-base plate combination starting at the center of the base plate and moving outward to the peripheral portions thereof;
In an automated process for producing a plurality of printed circuits a method for adhering a dry, thin film to flat base plates thru the application of pressure thereto, the improvement comprising, mechanically applying pressure to a dry thin film and a base plate in reduced pressure atmosphere of a vacuum chamber in accordance with a sequence of contact pressure being applied to the thin film-base plate combination starting at the center of the base plate and moving outward to the peripheral portions thereof;
Dependencies are inferred from the claim text.