Slicing method by a slicing machine

A slicing method by use of a slicing machine in which, after a cylindrical material is moved by a predetermined amount of indexing, the cylindrical material is moved to a rotating blade in the slicing direction of the blade and is sliced into a wafer having a predetermined thickness and, at the same time, a grinding wheel is moved to its grinding position to grind the first face of the wafer, said slicing method being characterized in that, in accordance with the actually measured data of the thickness of said wafer after slicing, the axial displacement data of said blade detected during slicing, and the actually measured data of the shapes of the end face of said cylindrical material after said wafer is sliced, a grinding position of the said grinding wheel in which the wafer after slicing has a predetermined thickness and an amount of indexing of said cylindrical material for minimization of an amount of indexing are calculated, said cylindrical material is moved downward in accordance with said amount of indexing, and said grinding wheel is moved to said grinding position, whereby a cylindrical slicing process and a wafer first face grinding process can be carried out simultaneously.