Flip-chip test socket adaptor and method
AssigneeTexas Instruments Incorporated
InventorsSatwinder Malhi, Oh K. Kwon, Shivaling S. Mahant-Shetti
Life of this patent
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Abstract
A test set socket adaptor (20) comprises a substrate (28), a plurality of cantilever beams (32) and a package (30). A bare chip (22) may be inserted into and held by the test socket adaptor (20) for insertion into a standard test socket. The cantilevers (32) are designed to deflect and compensate for variations in solder bumps (26) on the bare chip (22). The deflection of the cantilever beams (32) allows a positive contact between the solder bumps (26) and the cantilever beams for an AC and a burn-in test.
Claims20
An apparatus for providing electrical connection to integrated circuit die, comprising:
- a base;
- a support fixed to said base;
- and
- a plurality of pressure-sensitive contacts supported by said support to allow said contacts to deflect toward said base such that a die may be electrically connected to said contacts, said contacts comprising cantilever beams formed from a semiconductor material.
A method for forming an apparatus to make an electrical connection to an integrated circuit die, comprising the steps of:
- forming a base;
- forming a support over said base;
- and
- forming pressure-sensitive contacts comprising cantilever beams formed from a semiconductor material over said support to allow said contacts to deflect toward said base such that integrated circuits on the die may be electrically connected to said contacts.
Dependencies are inferred from the claim text.