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AssigneeInterflex Corporation
InventorsArthur J. DeMaso, Thomas H. Stearns
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This is a printed circuit comprising multiple layers and rigid and flexible portions and including a sheet of flexible substrate material extending over the entirety of the rigid and flexible portions and paths of conductive material carried by at least one side of the sheet of flexible substrate material. This invention comprises, a sheet of flexible over-layer material extending over at least the entirety of all the flexible portions; a flexible adhesive material adhesively attaching the sheet of flexible over-layer material to the entirety of all the flexible portions; sheets of a rigid substrate material extending over the entirety of all the rigid portions; and, a rigid adhesive material adhesively attaching the sheets of a rigid substrate material to the entirety of all the rigid portions. The rigid adhesive attaching the sheets of rigid substrate to the rigid portions may extend out over the edge of the rigid portions onto the flexible portions to form a protective edge. The sheet of flexible over-layer material may also extend over the rigid portions and be attached with a rigid adhesive.
A printed circuit comprising multiple layers and rigid and flexible portions comprising:
The method of assembling a printed circuit, comprising multiple layers and rigid and flexible portions, to prevent the formation of voids in adhesive layers thereof and breaks in vias formed therethrough comprising the steps of:
A printed circuit having multiple circuit layers including a flexible portion and a rigid portion carrying at least one via, each layer comprising:
Dependencies are inferred from the claim text.