Solid state image sensing device
AssigneeSeiko Epson Corporation
InventorShigeo Toda
Life of this patent
Estimating the term…
Abstract
A solid state image sensing device including a transparent support, at least one transparent substrate chip fixed on the support by a fixing agent, at least one photoelectric converting element on the transparent substrate chip and mold material for covering at least the exposed surfaces of the transparent substrate chip, in which the refractive index of the mold material is higher than or equal to that of the transparent substrate chip. The transparent substrate chips can be arranged in a line which is equal in optical and electrical continuity to a single-line solid state image sensing device of high precision and reliability.
Claims33
A solid state image sensing device, comprising:
- a transparent substrate for allowing incident light to pass therethrough;
- at least one transparent substrate chip mounted on the substrate and having exposed surfaces for receiving light passing through at least the substrate;
- at least one photoelectric converting element disposed on the transparent substrate chip for receiving light passing through at least the substrate and substrate chip;
- and
- anti-reflection mold material disposed on a portion of the transparent substrate and on at least the exposed surfaces of the transparent substrate chip, the refractive index of the anti-reflection mold material being equal to or higher than the refractive index of the transparent substrate chip.
The image sensing device of claim wherein the transparent substrate chip is secured to the substrate by a fixing agent having a refractive index equal to or higher than that of the transparent substrate chip.
A solid state image sensing device, comprising:
- a transparent substrate;
- at least two transparent substrate chips having faces mounted on the substrate and having exposed surfaces, so that two faces of adjacent chips oppose each other and a plurality of photoelectric converting elements are disposed on the transparent substrate chips and arranged in a straight line;
- anti-reflection mold material disposed on a portion of the transparent substrate and at least the exposed surfaces of the transparent exposed substrate chips;
- and
- filler material disposed between the opposing faces of the transparent substrate chips, the anti-reflection mold material and the filler material having a refractive index equal to or higher than that of the transparent substrate chips.
A solid state image sensing device, comprising:
- a transparent substrate film for allowing incident light to pass therethrough;
- a fixing agent disposed on said substrate;
- at least one transparent substrate chip mounted on the substrate film by the fixing agent and having exposed surfaces for receiving light passing through at least the substrate film and the fixing agent;
- at least one photoelectric converting element formed on the transparent substrate chip for receiving light passing through at least the substrate film, the fixing agent and the substrate chip;
- an insulating material substrate having inner walls defining an elongated inner opening, the inner walls dimensioned so that the opening is larger than the at least one transparent substrate chip and positioned to surround the substrate chip, the insulating material mounted on the substrate film by the fixing agent;
- and
- an anti-reflective mold material disposed on at least the exposed surfaces of the transparent substrate chip, the mold material having a refractive index equal to or higher than that of the transparent substrate chip.
Dependencies are inferred from the claim text.