Method and apparatus for notching a lead wire attached to an IC chip to facilitate severing the wire
AssigneeCray Computer Corporation
InventorsEckehart Zimmerman, Thomas A. Thorson
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AssigneeCray Computer Corporation
InventorsEckehart Zimmerman, Thomas A. Thorson
Estimating the term…
A method and apparatus for notching a wire so that it can be severed at the notched location by applying an axial force thereto. The apparatus includes a linearly reciprocal mechanism adapted to move forwardly, placing a pair of cutting blades in straddling relationship with the wire and includes an actuating mechanism for laterally reciprocating the cutting blades to form notches in opposite sides of the wire before retracting the cutting blades from the straddling relationship with the wire. The method of the invention includes the steps of moving a pair of cutting blades into straddling relationship with a wire, reciprocally moving the cutting blades into and out of cutting engagement with the wire and subsequently retracting the cutting blades from the straddling relationship with the wire.
A notcher for notching a wire to facilitate a separation of the wire by applying linear tensile separation force to a remaining portion of the wire at the notched location, comprising in combination:
A notcher for notching a wire to facilitate separation of the wire at the notched location, comprising in combination:
A notcher for notching a wire to facilitate a separation of the wire at the notched location, comprising in combination:
A method of forming a notch in a wire with a pair of spaced apart cutting blades to facilitate a subsequent separation of the wire by applying linear tensile separation force to a remaining portion of the wire at the notched location, comprising the steps of:
Dependencies are inferred from the claim text.