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US 5,066,550 AGranted
Electric contact
AssigneeYazaki Corporation
InventorsKinya Horibe, Tomio Hirano, Minoru Ikeda
Life of this patent
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Abstract
In an electric contact having a Cu-based layer, a Ni-based layer formed on the Cu-based layer, and a Pd-based layer formed on the Ni-based layer, the Ni-based layer having a thickness of at least 0.8 .mu.m is so formed as to include a noncrystal nickel alloy layer having a thickness of at least 0.08 .mu.m, in order to reduce the thickness of the Pd-based layer down to about 0.08 .mu.m, that is, the cost of the contact without deteriorating the contact durability, as compared with a 0.6 to 2 .mu.m thick prior-art Pd-based layer.
Claims13
An electric contact comprising:
- a) a metallic base layer;
- b) a Ni-based layer formed on said metallic base layer and having a thickness of from about 0.8 to about 2 .mu.m, said Ni-based layer being formed with a noncrystal Ni-based layer having a thickness of at least 0.08 .mu.m and with a crystal Ni-based layer having a thickness of less than about 1.92 .mu.m;
- and
- c) a noble-metal-based layer formed on said noncrystal Ni-based layer having a thickness of at least about 0.08 .mu.m.
1 more element
Dependencies are inferred from the claim text.