Interconnection structure and test method

A method for obtaining electrical interconnection of two electronic structures comprising the steps of:

• applying at least one first solder portion to the surface of the first of said structures;
• applying at least one second solder portion to the at least one first solder portion;
• disposing a first dielectric medium on the surface of said first structure covering said at least one solder portion and contacting, but not covering, said at least one second solder portion;
• applying at least one third solder portion to the surface of the second of said structures;
• bringing the at least one second solder portion associated with said first structure into contact with the at least one third solder portion on said second structure;
• and
• heating the contacted portions to a temperature sufficient to melt at least one of the contacting solder portions.

The method for obtaining electrical interconnection of two electronic structures comprising the steps of;

• applying at least one first solder portion to the surface of the first of said structures;
• applying at least one second solder portion to the at least one first solder portion;
• disposing a first dielectric medium on the surface of said first structure covering the at least one first solder portion and contacting, but not covering, said at least one second solder portion;
• applying at least one third solder portion to the exposed surface of said at least one second solder portion;
• providing at least one bonding site on the surface of said second structure;
• bringing the at least one third solder portion associated with said first structure into contact with said at least one bonding site on the second structure;
• and
• heating the at least one contacted portion and site to a temperature sufficient to melt the at least one third solder portion.