Heated plate rapid thermal processor
OwnerGeorge Chizinskyinventor
Life of this patent
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Abstract
A rapid thermal processor for heat treating and cooling semiconductor material is an elongated process chamber having a base, side and top walls which enclose a heater plate assembly through which thin pins longitudinally move to carry workpieces vertically to and from the heater assembly. A cooling shutter is adapted in the chamber to shield the workpiece from the heater plate when the cooling process takes place. The chamber has gaseous ambient control means which regulates the type of atmosphere or vacuum in the chamber during heat processing of the workpiece.
Claims5
A rapid thermal processor for heat processing and cooling of semiconductor wafer material, comprising:
- an elongated process chamber defined by a base, side walls and an upper wall;
- a heater plate disposed within said process chamber for delivering heat to and establishing the temperature of the wafer within said process chamber;
- means for advancing and withdrawing a wafer with respect to said heater plate;
- and
- cooling means disposed within said process chamber to facilitate rapid temperature drop within said wafer;
- and wherein said upper wall of said process chamber has an inner surface with a radiation absorbent material disposed thereon.
A rapid thermal processor for heat processing and cooling of semiconductor wafer material, comprising:
- an elongated process chamber defined by a base, side walls and an upper wall;
- a heater plate disposed within said process chamber for delivering heat to and establishing the temperature of the wafer within said process chamber;
- means for advancing and withdrawing a wafer with respect to said heater plate;
- and
- cooling means disposed within said process chamber to facilitate rapid temperature drop within said wafer;
- said means for advancing and withdrawing a wafer comprises a plurality of support pins;
- and
- a movable shutter means which is movable transversely with respect to said support pins, so as to facilitate cooling of a wafer on said support pins when they are distally advanced away from said heater plate, by shielding said wafer from said heater plate.
Dependencies are inferred from the claim text.