Iso-thermal seal process for electronic devices

An iso-thermal sealing process for electronic devices using a thermosetting adhesive comprising the steps of:

• preheating an entire package and an entire lid, said lid having a mating surface coated with said thermosetting adhesive;
• and
• mating together said heated package and said heated lid when iso-thermal conditions between said package, said lid and a surrounding medium are achieved.

An apparatus for sealing together an electronic package comprising:

• a first platen for holding a package, said first platen comprising a first means for hating said first platen and said ENTIRE package;
• and
• a second platen for holding a lid, said second platen comprising a second means for heating said second platen and said ENTIRE lid, and a handle means for handling said second platen, said second platen being operatively coupled to said first platen to achieve automatic alignment of said package and said lid in a sealing position.

An apparatus for sealing together an electronic package comprising:

• a first platen for holding a package, said first platen comprising a first means for heating said first platen and said ENTIRE package;
• and
• a second platen for holding a lid, said second platen comprising a second means for heating said second platen and said ENTIRE lid, said first platen and said second platen further comprising hinge means for operatively coupling said first platen and said second platen into a sealing position.

A sealing process for electronic devices using an adhesive comprising the steps of:

• preheating a package and a lid, said lid having a mating surface coated with said adhesive;
• and
• mating together said heated package and said heated lid when temperature equilibrium among said lid, said package, and an associated air space within said package and said lid is at a curing temperature of said adhesive, wherein said step of mating together comprises applying pressure to said mating surface through a first through-hole in said first platen with a first probe means for contacting said package.