Via capacitors within multi-layer, 3 dimensional structures/substrates
AssigneeHughes Aircraft Company
InventorsHal D. Smith, Robert F. McClanahan, Andrew A. Shapiro, George Pelzman
Life of this patent
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Abstract
A capacitor structure in a hybrid multilayer circuit having a plurality of insulating layers, the capacitor structure including a dielectric via fill in a via formed in one of the insulating layers, a first conductive element overlying the dielectric via fill, and a second conductive element underlying said dielectric via fill. Each of the first and conductive elements comprises a conductive via fill or a conductive trace.
Claims9
A capacitor structure in a hybrid multilayer, circuit having a plurality of insulating layers, comprising:
- a dielectric via fill in a via formed in one of the insulating layers;
- first conductive means overlying said dielectric via fill;
- and
- second conductive means underlying said dielectric via fill.
A capacitor structure in a hybrid multilayer circuit having a plurality of insulating layers, comprising:
- a first dielectric via fill in a via formed in a first insulating layer of the hybrid;
- a second dielectric via fill formed in a via in a second insulating layer;
- a dielectric region in each of at least one insulating layer between said first and second insulating layers;
- and
- conductive means overlying and/or underlying said dielectric via fills.
A capacitor structure in a hybrid multilayer circuit having a plurality of insulating layers, comprising:
- a first group of dielectric via fills in first vias in a first group of adjacent insulating layers;
- a second group of dielectric via fills in second vias in a second group of adjacent insulating layers;
- a dielectric region in each of at least one insulating layer between said first group of adjacent insulating layers and said second group of adjacent insulating layers;
- and
- conductive means overlying and/or underlying said dielectric via fills.
A capacitor structure in a hybrid multilayer circuit having a plurality of insulating layers, comprising:
- one or more axially aligned dielectric via fills in respective vias formed in respective adjacent insulating layers;
- and
- first conductive means disposed over said one or more axially aligned dielectric via fills;
- and
- second conductive means disposed beneath said one or more dielectric via fills.
A capacitor structure in a hybrid multilayer circuit having a plurality of insulating layers, the capacitor structure comprising:
- a plurality of dielectric via fills;
- a plurality of conductive elements overlying and/or underlying said dielectric via fills and cooperating therewith to form via capacitors;
- and
- a plurality of conductive via fills for electrically connecting selected ones of said conductive elements to areas of the hybrid that are accessible for connection after fabrication of the hybrid, whereby said via capacitors can be connected or shorted as required.
Dependencies are inferred from the claim text.