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US 5,049,332 AGranted
Method of making conductive metal-filled substrates without developing agents
AssigneeAkzo N.V.
InventorsKarolyn E. Ziemer, William J. E. Parr
Life of this patent
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Abstract
A conductive-metal-filled substrate is formed by intermingling oxide coated, non-conductive copper or nickel particles into a substrate having a softening point of at least 200.degree. C. followed by compression molding at a temperature of at least 200.degree. C. The filled substrates are electrically conductive and are useful for a variety of uses such as EMI shielding.
Claims6
A method of forming a conductive copper or nickel metal-filled substrate in which the copper or nickel is the sole source of conductivity, comprising:
- a. an intermingling step of powder blending substantially non-conductive oxide coated copper or nickel metal particles having a number average particle size less than 50 microns in a finely-divided powdered substrate material having a softening point of at least about 200.degree. C. and selected from the group consisting of polyetheretherketones (PEEK), polyetherketones (PEK), polyarylates, polysulfones, polyarylsulfone, liquid crystalline polymers, and thermoplastic polyimide resins;
- and
- b. a molding step of subjecting the blended metal particles and the substrate first to a pressure sufficient to render the metal particles conductive and then raising the blend to a temperature at said pressure above the flow temperature of the substrate.
Dependencies are inferred from the claim text.