Method and apparatus for writing or etching narrow linewidth patterns on insulating materials

A method for producing fine linewidth patterns on an insulating substrate, including the following steps:

• bringing to close proximity an insulating substrate and a conductive pointed tip, said pointed tip being connected to a spring-like cantilever and a voltage source.
• emitting electrons from said pointed tip by applying a voltage thereto, affecting molecules at the surface or within said insulator there being no highly electrically conductive return path for said electrons through said substrate, said electrons traveling to said substrate and producing a negatively charged localized region on the surface of said substrate,
• exposing said negatively charged localized region to a positively charged gas or particle cloud,
• reacting said positively charged gas or particle cloud at said localized negatively charged region of said substrate surface to etch said insulator layer at said charged region to produce a fine linewidth recess in said insulator,
• moving said pointed tip and said insulating substrate relative to one another and repeating said steps to create another fine linewidth recess in the surface of said insulator.

A method for producing a fine linewidth pattern on the surface of an insulating substrate, including the following steps:

• bringing to close proximity an insulating substrate and a conductive pointed tip, said pointed tip being connected to a conductive spring-like cantilever and to a voltage source,
• applying a voltage to said pointed tip to emit electrons therefrom, said electrons traveling from said pointed tip to said insulating substrate and affecting molecules at the surface or within said insulator, there being no highly electrically conductive path for electrons through said substrate,
• exposing a localized region of the surface of said insulating substrate to said electrons to produce a local negatively charged region of said insulator,
• exposing said negatively charged localized region to a positive gas or particle cloud,
• reacting said positive gas or particle cloud at said negatively charged localized region to deposit a constituent of said gas or particle cloud at said localized region to thereby produce a fine linewidth pattern,
• providing relative motion between said insulating substrate and said pointed tip and repeating the heretofore mentioned steps to create a fine linewidth pattern at another location on said insulator substrate.

An apparatus for exposure of a nonconductive, electron-sensitive resist layer located on an insulating substrate, comprising the following components:

• a conductive pointed tip connected to a conductive spring-like cantilever,
• a voltage source electrically connected to said pointed tip through said cantilever,
• displacement means for producing relative motion between said pointed tip and said insulating substrate,
• means for activating said voltage source to produce a fine linewidth pattern of electrons emanating from said pointed tip, said electrons traveling to said insulating substrate and affecting molecules at the surface or within said insulator, there being no highly conducting electrical return path for said electrons through said insulating substrate, and
• means for adjusting the distance between said pointed tip and said insulating substrate.

In combination,

• a pointed tip of nanometer radius sharpness,
• said tip being comprised of a conductive material,
• a conductive, spring-like cantilever connected to said pointed tip,
• a voltage source connected to said cantilever for providing a voltage at said pointed tip,
• applying a voltage to said pointed tip to emit electrons therefrom, said electrons traveling to an insulating substrate and affecting molecules at the surface or within said insulator, there being no highly conducting return path for said electrons through said insulating substrate,
• displacement means for producing relative motion between said pointed tip and said substrate to scan said tip relative to said substrate in an X-Y plane,
• further displacement means for producing relative motion in a Z-direction between said tip and said substrate to vary the tip-to-substrate distance to thereby establish the Z coordinate of said pointed tip for succession of X-Y displacements.