Electronic device housing with temperature management functions

A housing for an electronic device having a first circuit with an operating parameter affected by variations in temperature and a second circuit developing undesired heat to be removed therefrom, said housing comprising:

• a case formed of a relatively thermally non-conductive material having at least first and second thermally separated cavities for receiving said first and second circuits respectively;
• a heat transfer plate including a thermal path operatively communicating with the second circuit when received in said second cavity, for transferring undesired heat from said second cavity to the exterior of said housing;
• said thermally non-conductive case surrounding said first cavity thermally isolating the first circuit from the environment when mounted therein while said thermal transfer plate transfers heat from said second circuit when mounted in said second cavity.

An electronic device housing for containing electronic components including at least one heat generating component comprising:

• a case formed of a thermally insulating non-conductive material coated on at least one surface thereof with an electromagnetic shielding coating, said case having a heat transfer opening provided therein on an opening bearing surface thereof;
• thermal transfer means, connected to said heat generating component, for conducting heat from said heat generating component through said heat transfer opening to the exterior of said case, said heat transfer means including a heat transfer plate extending across said opening bearing surface of said case and further functioning to provide electromagnetic shielding to said opening bearing surface;
• said thermally insulating non-conductive material forming said case insulating said electronic components from environmental temperature variations while said thermal transfer means removes undesired heat from said heat generating component from inside said device housing.

The housing of claim 51 wherein said heat transfer plate generally conforms to the bottom and at least two sides of said case.

An electronic device housing for containing electronic components including at least one heat generating component comprising:

• a case formed of a thermally insulating non-conductive material coated on at least one surface thereof with an electromagnetic shielding coating, said case having a heat transfer opening provided therein on an opening bearing surface thereof;
• thermal transfer means, connected to said heat generating component, for conducting heat from said heat generating component through said heat transfer opening to the exterior of said case, said heat transfer means including a heat transfer plate inserted into and occupying said opening in said case and further functioning to provide electromagnetic shielding to said opening bearing surface;
• said thermally insulating non-conductive material forming said case insulating said electronic components from environmental temperature variations while said thermal transfer means removes undesired heat from said heat generating component from said device housing.

A housing for an electronic device having a first circuit with an operating parameter affected by variations in temperature and a second circuit developing undesired heat to be removed therefrom, said housing comprising:

• a case formed of a relatively thermally non-conductive material having at least first and second cavities separated by a thermally insulated wall for receiving said first and second circuits respectively, said case having a heat transfer opening between said second cavity and the exterior of said case;
• a thermal transfer plate, connected to said heat generating component when received in said second cavity, for conducting heat from said heat generating component through said opening to the exterior of said case;
• said thermally insulated wall between said first and second cavities and said thermal transfer plate collectively preventing the heat generated by said heat generating device from adversely affecting the operating parameter of said first circuit.