Conductive adhesive useful for bonding a semiconductor die to a conductive support base
AssigneeAdvanced Products, Inc.
InventorsAndrew Chen, Richard L. Frentzel
Life of this patent
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Abstract
A conductive die attach composition containing no solvent and substantially no ionic impurities which comprises: (a) an epoxy resin system comprising (i) at least one low viscosity epoxy resin; and (ii) at least one epoxy resin hardener; (b) at least one unsaturated monomer which, when polymerized, is not capable of reacting with said epoxy resin system; (c) at least one free radical initiator for polymericing said unsaturated monomer; and (d) finely divided silver particles.
Claims20
A conductive die attach composition containing no solvent and substantially no ionic impurities which comprises:
- (a) an epoxy resin system comprising
- (i) 6-18 parts by weight at least one low viscosity liquid epoxy resin;
- and
- (ii) 0.1-3 parts by weight at least one epoxy resin hardener;
- (b) 1.5-7.0 parts by weight at least one unsaturated monomer which, when polymerized, is not capable of reacting with said epoxy resin system;
- (c) 0.01-0.1 parts by weight at least one free radical initiator for polymerizing said unsaturated monomer;
- and
- (d) 70-90 parts by weight finely divided silver particles.
A semiconductor die bonded to a conductive support base by means of a conductive adhesive composition wherein said conductive adhesive composition before curing contains no solvent and substantially no ionic impurities and comprises:
- (a) an epoxy resin system comprising
- (i) 6-18 parts by weight at least one low viscosity liquid epoxy resin;
- and
- (ii) 0.1-3 parts by weight, at least one epoxy resin hardener;
- (b) 1.5-7.0 parts by weight at least one unsaturated monomer which, when polymerized, is not capable of reacting with said epoxy resin system;
- (c) 0.01-0.1 parts by weight at least one free radical initiator for polymerizing said unsaturated monomer;
- and
- (d) 70-90 parts by weight finely divided silver particles.
The bonded semiconductor die of claim 32 wherein the relative amounts of each component are as follows:
- (a) epoxy resin system
- (i) epoxy resin--8-16 parts by weight;
- (ii) epoxy resin hardener--0.2-2 parts by weight;
- (iii) epoxy resin accelerator--0.2-1.1 parts by weight;
- (b) unsaturated monomer--1.8-6.0 parts by weight;
- (c) free radical initiator--0.02-0.08 parts by weight;
- and
- (d) silver particles--75-85 parts by weight.
Dependencies are inferred from the claim text.