Apparatus for retaining wafers

A device for releaseably holding a semiconductor wafer, comprising:

• a platen;
• a resilient member having a plurality of finger members extending therefrom, said resilient member extending between and connected to said finger members;
• elastomeric means for attaching said resilient member to said base;
• an actuating member for elastically deforming said resilient member and said elastomeric means to pivot said finger members from a first position for holding said workpiece to a second position;
• and
• means coupled to said platen for retaining said actuating member in said device.

A device for releaseably holding a workpiece, comprising:

• a base;
• a resilient member having a plurality of finger members extending therefrom, said resilient member extending between and connected to said finger members;
• elastomeric means for attaching said resilient member to said base;
• means for elastically deforming said resilient member and said elastomeric means to pivot said finger members from a closed position for holding said workpiece to an open position;
• and
• an elastomeric bumper attached to said resilient member for preventing contact between said resilient member and said base as said resilient member is deformed.

A device for holding a semiconductor wafer for processing, comprising:

• a platen having a clamping surface for receiving a semiconductor wafer;
• a clamping member comprising a resilient annular ring having an inner periphery and an outer periphery and a plurality of finger members attached to and spaced apart on the outer periphery of said annular ring;
• elastomeric means for attaching said clamping member to said platen, said elastomeric means comprising a plurality of elastomeric members attached to the outer periphery of said annular ring between said finger members, said clamping member being attached to said platen such that said finger members are spaced around the periphery of said clamping surface and extend at least slightly above said clamping surface;
• and
• means for deforming said annular ring such that said finger members are moved between a closed position in contact with an edge of said semiconductor wafer for holding said semiconductor wafer against said clamping surface and an open position in which said semiconductor wafer is released.