Method of and apparatus for inspecting printed circuit boards and the like
AssigneeOMRON Corporation
InventorsShigeki Kobayashi, Hideaki Takahara
Life of this patent
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Abstract
Disclosed is a substrate inspecting method in which light is projected to a part (21) mounted on a substrate (20) from a ring-shaped light source (29), reflected light form the surface of a soldered portion (44) is imaged by an imaging unit (32) and the nature of the soldered portion is inspected by its imaged pattern, characterized by applying fluorescent agents (70) to at least the periphery of the soldered portion of the mounted part on the surface of the substrate, exposing the surface coated with the fluorescent agents to light from the ring-shaped light source to excite the fluorescent agents, exposing the surface of the soldered portion to secondary illuminating light produced by the fluorescent agents to image its reflected light.
Claims19
A substrate inspecting apparatus for inspecting a part mounted on a substrate for the integrity of a soldered portion thereon, comprising:
- light projecting means including a plurality of ring-shaped light sources for directing light of different hues to said part obliquely from one direction at different angles of incidence;
- first imaging means including a color camera for imaging reflected light from the surface of a portion to be inspected by hues on the center line of each of the ring-shaped light sources in a position directly over the part;
- second imaging means including a color or monochrome camera for imaging the reflected light from the surface of said portion to be inspected in a position around the side of the part;
- and
- determining and processing means for detecting the nature of the soldered portion by an imaged pattern obtained by each of the first and second imaging means to determine whether or not soldering is acceptable.
A substrate inspecting apparatus for inspecting a part mounted on a substrate for the integrity of a soldered portion thereon, comprising:
- light projecting means including a ring-shaped light source for directing white light to said part obliquely from one direction;
- first imaging means including a color camera for imaging reflected light from the surface of a portion to be inspected on the center line of the ring-shaped light source in a position directly over the part;
- second imaging means including a monochrome camera for imaging the reflected light from the surface of said portion to be inspected in a position around the side of the part;
- and
- determining and processing means for detecting the integrity of the soldered portion by an imaged pattern obtained by each of the first and second imaging means to determine whether or not soldering is acceptable.
A substrate inspecting method in which light is directed to a part mounted on substrate from a ring-shaped light source, reflected light from the surface of a soldered portion is imaged and the integrity of the soldered portion is inspected by its imaged pattern, characterized by applying fluorescent agents to at least the periphery of the soldered portion of the mounted part on the surface of said substrate, exposing the surface coated with the fluorescent agents to light from said ring-shaped light source to excite the fluorescent agents, exposing the surface of the soldered portion to secondary illuminating light produced by the fluorescent agents to image light reflected therefrom.
Dependencies are inferred from the claim text.