Apparatus for characterization of electrical properties of a semiconductor body
AssigneeSolid State Measurements, Inc.
InventorsRobert G. Mazur, Robert C. Stephenson, Donald A. Zier, Jr.
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AssigneeSolid State Measurements, Inc.
InventorsRobert G. Mazur, Robert C. Stephenson, Donald A. Zier, Jr.
Estimating the term…
An apparatus for the measurement of electrical properties of a semiconductor wafer is disclosed. A top contact mercury probe for contacting the upper surface of a wafer body is provided. The mercury probe is held by a kinematically stable probe arm which provides for very controlled movement of the mercury probe. A semiconductor wafer body horizontal and rotational movement system is provided for moving the wafer body to provide mapping capability. A top side return contact for doing measurements on wafer bodies with insulating substrates is disclosed. The top side return contact is also provided with a self-levelling and raising function, which ensures the bottom surface of the contact member to intimately contact the upper surface of the wafer body when desired, and also to raise the contact member off the wafer body when the bottom contact underneath the wafer is utilized.
An apparatus for measurement of electrical properties of semiconductor wafer body, said apparatus comprising:
Dependencies are inferred from the claim text.