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US 5,025,133 AGranted
Semiconductor wafer heating device
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsKouichirou Tsutahara, Hiroshi Tanaka
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Abstract
A semiconductor wafer heating device includes a hollow heating stage. A semiconductor wafer is disposed over one surface of the heating stage and a heater is provided over the other surface thereof. A fluid having an excellent heat conductivity which is filled in the hollow space of the heating stage is stirred uniformly. In consequence, the surface temperature of the heating stage can be made uniform without employing a thick heating stage, and an excellent temperature control of the heating stage can be ensured.
Claims5
A semiconductor wafer heating device comprising:
- a hollow heating stage having opposed first and second surfaces, the first surface for supporting a semiconductor wafer;
- an electrically conducting fluid of relatively high thermal conductivity disposed within the hollow heating stage;
- a magnet movable relative to said stage for generating a rotating magnetic field within said stage directly coupled to said electrically conductive fluid to stir said fluid;
- and
- heating means disposed on the second surface of said heating stage for heating the stage.
2 more elements
Dependencies are inferred from the claim text.