# US 5,015,206 A · Solder terminal > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,015,206 A - Document ID: US5015206A - Status: Granted - Kind: A - Application number: 07/504,946 - Filed: 1990-04-05 - Granted: 1991-05-14 - Earliest claimed: 1990-04-05 - Assignees: Die Tech, Inc. - Inventors: Richard K. Dennis - Web page: https://patentgrep.com/patent/US5015206A ## CPC - H01R 12/57: surface mounting terminals - H05K 3/3405: {Edge mounted components, e.g. terminals} - H01R 4/02: Soldered or welded connections {(H01R4/625, H01R4/723, H01R12/59 take precedence)} - H05K 2201/10386: Clip leads; Terminals gripping the edge of a substrate - H05K 2201/10984: Component carrying a connection agent, e.g. solder, adhesive - Y10T 29/49204: Contact or terminal manufacturing - H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A solder terminal includes a clip adapted to be positioned on one edge of a substrate for forming soldered electrical connections with substrate pads. One end of the clip extends away from the substrate for making an electrical connection with a circuit component. ## Claims ### Claim 1 A solder terminal including a contact element and a first arm joined to the element, the arm having a flat base with opposed edges, and in integral solder mass comprising a thin flat solder layer integrally bonded to the base and a pair of solder reservoirs extending along the edges of the base and joined to the thin solder layer only. ### Claim 2 (depends on 1) A solder terminal as in claim 1 wherein the solder reservoirs are located below the thin solder layer. ### Claim 3 (depends on 2) A solder terminal as in claim 2 wherein the thin solder layer and solder reservoirs are coined from a single solder mass bonded to the flat base and the reservoirs are extrusion-formed. ### Claim 4 (depends on 1) A solder terminal as in claim 1 including a clip having a second arm located adjacent the first arm and a bridge joining the arms, said base facing the second arm. ### Claim 5 (depends on 4) A solder terminal as in claim 4 wherein said second arm includes a contact ridge facing the base. ### Claim 6 (depends on 5) A solder terminal as in claim 5 wherein the contact ridge extends across the width of the other arm. ### Claim 7 (depends on 4) A solder terminal as in claim 4 including a continuous, thin U-shaped layer extending around the interior surfaces of the arms and the bridge, the thin flat solder layer forming part of the U-shaped layer, and U-shaped solder reservoirs are integral with the thin shaped layer and each extending around one side edge of the clip. ### Claim 8 (depends on 7) A solder terminal as in claim 7 wherein the thin solder layer has a thickness of approximately 0.0005 inch and such layer and solder reservoirs are coined from a single solder mass bonded to the arms and bridge. ### Claim 9 A solder terminal including a contact for establishing an electrical connection with circuit elements and a clip at one end of the contact, said clip including first and second opposed contact arms and a bridge joining said arms, the interior surface of one arm including a flat base facing the other arm, the interior surface of the other arm including a transverse contact ridge facing the one arm, and an integral solder mass including a thin U-shape solder layer extending around and bonded to the interior surfaces of the clip arms and bridge and overlying the flat base and the contact ridge and a pair of U-shaped solder reservoirs located at the lateral strip edges and joined to the edges of the thin solder layer only. ### Claim 10 (depends on 9) A solder terminal as in claim 9 wherein said thin solder layer is approximately 0.0005 inches thick. ### Claim 11 (depends on 10) A solder terminal as in claim 10 wherein said reservoirs extend outwardly beyond the arms at the contact surface and ridge. ### Claim 12 The method of manufacturing a solder terminal having a solder coated contact with integral solder reservoirs including the steps of: a. bonding a solder body to a portion of a terminal strip having side edges; and b. coining the solder body to reduce the thickness of the solder overlying the strip, form a thin solder strip and extrude such solder laterally past both edges of the strip and form large volume solder reservoirs extending along the edges of the strip. ### Claim 13 (depends on 12) The method of claim 12 including the step of forming said solder reservoirs below the surface of the thin solder strip. ### Claim 14 (depends on 12) The method of claim 12 including the step of forming said portion into a contact clip having opposed arms and a bridge joining the arms. ### Claim 15 (depends on 14) The method of claim 14 including the step of forming U-shaped solder reservoirs extending around both edges of the clip. ### Claim 16 (depends on 14) The method of claim 14 including the step of forming a flat contact surface on one clip arm and a contact ridge on the other clip arm across from the contact surface. ### Claim 17 (depends on 16) The method of claim 16 including forming said contact ridge extending across the width of the contact portion.