US 5,014,161 A · System for detachably mounting semiconductors on conductor substrate

Abstract

A semiconductor mounting system is provided for the detachable surface mounting of one or more semiconductor dies on a conductor substrate, such as a ceramic substrate or printed circuit board. The system employs a resilient, anisotropic conductor pad which is interposed between the semiconductor die and the conductor substrate. The conductor pad is capable of conducting electric signals in one direction only, and insulates in the other two orthogonal directions. Thus, by compressing the semiconductor die and resilient conductor pad against the conductor substrate, electrical contact is established between contacts on the semiconductor die and corresponding contacts on the conductor substrate. In the preferred embodiment, additional conductor pads are placed over the semiconductor dies, and a heat sink placed over the second conductor pads. In this way, the semiconductor dies are mounted in a resilient structure for protection, while heat dissipation is enhanced by the metallic elements in the second conductor pad.

Claims20

Dependent claims

A semiconductor die mounting system comprising:

a) a conductor substrate having an array of substrate contacts on a substrate face thereof;
b) at least one semiconductor die having first and second opposed die faces and a plurality of die contacts on the first die face thereof disposed in alignment with corresponding substrate contacts on the conductor substrate;
c) a conductor pad disposed between the substrate and the die having first and second opposed pad surfaces in contact with the substrate and first die faces, respectively, the conductor pad including a plurality of mutually electrically isolated electrically conductive elements extending between the first and second surfaces thereof in the direction of alignment between the substrate and die contacts so as to provide electrical conduction between the pad surfaces, adjacent conductive elements being spaced apart by less than the minimum width of the contacts;
and
d) means for holding the semiconductor die and the conductor substrate in contact with the conductor pad so that the corresponding die and substrate contacts are in alignment.

2 more elements

A semiconductor die mounting system comprising:

a) a conductor substrate having an array of substrate contacts on a substrate face thereof;
b) at least one semiconductor die having first and second opposed die faces and a plurality of die contacts on the first die face thereof disposed in alignment with corresponding substrate contacts on the conductor substrate;
c) a first conductor pad disposed between the substrate and the die having first and second opposed pad surfaces in contact with the substrate and first die faces, respectively, the conductor pad including a plurality of mutually electrically isolated electrically conductive elements extending between the first and second surfaces thereof in the direction of alignment between the substrate and die contacts so as to provide electrical conduction between the pad surfaces, adjacent conductive elements being spaced apart by less than the minimum width of the contacts;
d) means for holding the semiconductor die and the conductor substrate in contact with the first conductor pad so that the corresponding die and substrate contacts are in alignment;
e) a cover mounted on the means for holding the semiconductor die and the conductor substrate, the cover including a cover face;
and
f) a second conductor pad disposed between the semiconductor die and the cover, the second conductor pad having first and second opposed surfaces in contact with a cover face and the second die face, respectively, and including a plurality of thermally conductive elements extending between the first and second surfaces so as to provide thermal conduction between the die and the cover.

4 more elements

A semiconductor die mounting system comprising:

a) a conductor substrate having an array of substrate contacts on a substrate face thereof;
b) at least one semiconductor die having first and second opposed die faces and a plurality of die contacts on the first die face thereof disposed in alignment with corresponding substrate contacts on the conductor substrate;
c) a first conductor pad disposed between the substrate and the die having first and second opposed pad surfaces in contact with the substrate and first die faces, respectively, the conductor pad including a plurality of mutually electrically isolated electrically conductive elements extending between the first and second surfaces thereof in the direction of alignment between the substrate and die contacts so as to provide electrical conduction between the pad surfaces, adjacent conductive elements being spaced apart by less than the minimum width of the contacts;
d) a nest plate mounted over the conductor substrate for aligning the contacts on the conductor substrate with the contacts on the semiconductor die;
e) a cover having a cover face mounted on the nest plate;
and
f) a second conductor pad disposed between the semiconductor die and the cover, the second conductor pad having first and second opposed surfaces in contact with a cover face and the second die face, respectively, and including a plurality of thermally conductive elements extending between the first and second surfaces so as to provide thermal conduction between the die and the cover.

4 more elements

Dependencies are inferred from the claim text.

System for detachably mounting semiconductors on conductor substrate

Life of this patent

System for detachably mounting semiconductors on conductor substrate

Life of this patent

Abstract

Claims20