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US 5,013,900 AGranted
Identification card with integrated circuit
AssigneeGAO Gesellschaft fur Automation und Organisation mbH
InventorJoachim Hoppe
Life of this patent
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Abstract
A multilayer identification card containing an IC module in a cavity. The cavity is filled with a polymer with a consistency ranging from liquid to pasty before the card compound is laminated using pressure and heat. During lamination, the polymer completely fills in the cavity around the IC module, supported by the applied pressure. In the finished card, the polymer is cross-linked to form a solid, rubber-like mass, which protects the IC module in the cavity of the card.
Claims14
A multilayer card construction comprising:
- (a) at least one layer having an opening for accommodating an IC module;
- (b) at least one layer having space for receiving elastic material;
- (c) an IC module positioned in said opening;
- and
- (d) an elastic material filling at least a portion of said space for receiving elastic material in an amount effective for protecting said IC module and minimizing disturbance in said card construction.
2 more elements
Dependencies are inferred from the claim text.