US 5,012,386 A · High performance overmolded electronic package

Abstract

A package for containing high performance electronic components, such as high speed integrated circuits (ICs). The package bears a substrate of multiple layers having a cavity therein. Leads may be placed within holes in the substrate and soldered or otherwise electrically connected to conductive patterns or layers in the substrate. A thermally conductive insert is attached to one side of the substate. The insert has a pedestal which protrudes through the cavity in the substrate. An electronic component, such as an IC may then be mounted on the pedestal and electrically connected to a conductive metal pattern on one of the layers of the substrate. This assembly may then be coated with a dielectric material to form the package body, leaving the distal ends of the leads and the back side of the insert exposed. Since the IC chip or other component is directly mounted on the insert, waste heat generated by the chip may be directly channeled outside the package through the insert which effectively forms one wall of the package. The exposed leads may be formed into the desired configuration, including shapes suitable for surface mount technology. The use of a multiple layer substate permits the inclusion of ground and power planes for high performance circuits, such as emitter coupled logic (ECL) gate arrays, within the package itself.

Claims24

Dependent claims

An electronic package comprising:

a substrate having:
a plurality of planar layers, where at least one layer is a dielectric layer and where at least one layer is an electrically conductive layer;
at least one hole through the plurality of layers;
and
a cavity within the layers;
a lead having a proximal end and a distal end, where the proximal end pierces the hole through the plurality of layers, where the proximal end is additionally electrically connected to the electrically conductive layer;
a thermally conductive insert adjacent to the dielectric layer, where the insert has a first side and a second side, where a die area is present on the first side which is exposed through the cavity within the layers;
an electronic component having a front surface and a back surface, where its back surface is mounted on the die area of the thermally conductive insert and where the front surface is electrically connected to the electrically conductive layer;
and
a body of dielectric material surrounding the substrate and the electronic component, where the distal end of the lead and at least a portion of the second side of the thermally conductive insert are not surrounded by the body.

7 more elements

An electronic package comprising:

a substrate having:
a plurality of planar layers, where at least one layer is a dielectric layer and where at least one layer is an electrically conductive layer;
at least one hole through the plurality of layers, substantially normal to the layers;
and
a cavity through the layers;
leads for the holes in the substrate, where each lead has a proximal end, a body portion and a distal end, where the proximal end pierces the hole through the plurality of layers, where the proximal end is additionally electrically connected to the electrically conductive layer and the body portion is parallel to the substrate such that the angle between the proximal end and the lead body is substantially 90.degree.;
a planar thermally conductive insert adjacent to the dielectric layer, where the insert has a first side and a second side, where a pedestal is present on the first side which protrudes through the cavity within the layers;
an electronic component having a front surface and a back surface, where its back surface is mounted on the pedestal of the thermally conductive insert and where the front surface is electrically connected to the electrically conductive layer;
and
a body of dielectric material surrounding the substrate and the electronic component, where the distal end of the lead and at least a portion of the second side of the thermally conductive insert are not surrounded by the body.

7 more elements

A high performance, surface mount electronic package comprising:

a substrate having:
a plurality of planar layers, where at least one layer is a dielectric layer, where at least one layer is a patterned electrically conductive layer, and at least one ground plane and at least one power plane;
at least one hole through the plurality of layers, substantially normal to the layers;
and
a cavity through the layers;
leads for the holes in the substrate, where each lead has a proximal end, a body portion and a distal end, where the proximal end pierces the hole through the plurality of layers, where the proximal end is additionally electrically connected to the electrically conductive layer and the body portion is parallel to the substrate such that the angle between the proximal end and the lead body is substantially 90.degree.;
a planar thermally conductive insert adjacent to the dielectric layer, where the insert has a first side and a second side, where a pedestal is present on the first side which protrudes through the cavity within the layers;
an electronic component having a front surface and a back surface, where its back surface is mounted on the pedestal of the thermally conductive insert and where the front surface is electrically connected to the electrically conductive layer;
a body of dielectric material surrounding the substrate and the electronic component, where the distal end of the lead and at least a portion of the second side of the thermally conductive insert are not surrounded by the body;
and
distal lead ends suitable for surface mounting, where the shape is selected from he group consisting of J-lead, gull-wing and butt lead.

8 more elements

Dependencies are inferred from the claim text.

High performance overmolded electronic package

Life of this patent

High performance overmolded electronic package

Life of this patent

Abstract

Claims24