Thermally conductive organosiloxane compositions
AssigneeDow Corning Corporation
InventorAdam L. Peterson
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Abstract
The combination of known thermally conductive fillers having an average particle size of from about 10 to about 100 microns with aluminum nitride having an average particle size of less than one micron improves the thermal conductivity of organosiloxane compositions. The thermal conductivity values achieved using this combination of fillers is higher than can be achieved using the maximum loading of either filler alone that can be present without adversely affecting the ability of the organosiloxane composition to cure or to serve as useful coatings and encapsulates for electronic solid state devices and other substrates.
Claims3
In an organosiloxane composition comprising a polyorganosiloxane and a finely divided solid thermally conductive filler, the improvement comprising the presence in said composition of a mixture of thermally conductive fillers comprising (1) from 20 to 60 weight percent, based on the weight of said mixture, of a first filler consisting essentially of aluminum nitride having an average particle size no larger than one micron and (2) at least one additional thermally conductive filler having an average particle size of from 10 to 100 microns. where said mixture constitutes from 40 to 85 percent of the total weight of said composition.
Dependencies are inferred from the claim text.