Fabrication of pad array carriers from a universal interconnect structure
AssigneeMotorola, Inc.
InventorsBruce J. Freyman, Barry M. Miles, Jill L. Flaugher
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Abstract
A method of manufacturing a chip carrier from a universal ceramic substrate provides for a universal ceramic substrate having first and second opposed sides and an array of conductively filled through-holes. On the first side, wire bond pads and conductors connected to the conductively filled through-holes are provided as required. Similarly, on the second side, solder pads on the conductively filled through-holes are provided as required. Finally, at least one insulating layer is provided over part of the first side for die attachment.
Claims20
A method of manufacturing a chip carrier from a universal ceramic substrate, comprising the steps of:
- providing a universal ceramic substrate having first and second opposed sides and an array of conductively filled through-holes pre-formed prior to a firing of said universal ceramic substrate;
- providing wire bond pads and conductors connected to said conductively filled through-holes as required on said first side;
- providing solder pads on said conductively filled through-holes as required on said second side;
- and
- providing at least one insulating layer over part of said first side for die attachment.
A method of manufacturing a plurality of chip carriers from a universal ceramic substrate, comprising the steps of:
- providing a universal ceramic substrate having first and second opposed sides and an array of conductively filled through-holes pre-formed prior to a firing of said universal ceramic substrate which is able to accommodate an arbitrary design of said plurality of chip carriers depending on connections of said through-holes;
- partitioning said universal ceramic substrate into an arbitrary quantity of sections depending on an arbitrary quantity of ports desired;
- metallizing and delineating wire bond pads and conductors connected to said conductively filled throug-holes as required on said first side;
- metallizing and delineating solder pads on said conductively filled through-holes as required on said second side;
- applying dielectric material and delineating at least one insulating layer over part of said first side for die attachment;
- and
- severing said universal ceramic substrate into said sections for forming said plurality of chip carriers.
A chip carrier, comprising:
- a universal ceramic substrate having first and second opposed sides and an array of conductively filled through-holes pre-formed prior to a firing of said universal ceramic substrate;
- wire bond pads and conductors connected to said conductively filled through-holes as required on said;
- solder pads connected to said conductively filled through-holes as required on said second side;
- and
- at least one insulating layer applied over part of said first side for die attachment.
Dependencies are inferred from the claim text.