Method and apparatus for manufacturing preform panels with preforms for repairing interconnects

A method for manufacturing preform panels having at least one preform for repairing interconnects with a preform plated with hard solder, comprising the steps of:

• providing at least two successive punch events on a metal band with a die;
• performing a predetermined feed (V) of the metal band relative to the die between the two punch events, whereby the length of the feed (V) is greater than a die width of the die, a length of the die being shorter than a width of the metal band, and the preform being formed by a residual web of the metal band after the two successive punch events;
• and
• providing at least one additional feed (V) between the two successive punch events for reinforcing the preform panel by forming a broad residual web.

An apparatus for manufacturing preform panels having at least one preform from a metal band comprising:

• a receptacle plate on a carriage for the acceptance of the metal band;
• a die with a means for hold-down of the metal band when the die punches the metal band;
• a motor for generating a predetermined feed between the die and the metal band;
• at least two positioning pins for positioning the metal band on the receptacle plate;
• a die-plate that cooperates with the die, the die with the means for hold-down being perpendicularly movable up and down;
• a clamp mechanism for the metal band held against the receptacle plate by permanent magnets, said clamp mechanism being composed of:
• at least one permanent magnet attached to the receptacle plate;
• at least one auxiliary plate for supporting at least a first portion of the metal band, the auxiliary plate held to the receptacle plate by the permanent magnet;
• and
• at least one clamp plate for locking the metal band on the receptacle plate, said clamp plate being at least partially located over at least a second portion of the metal band and the permanent magnet being located under the second portion of the metal band.