Dispersion strengthened copper alloy and a method of manufacturing the same
AssigneeKabushiki Kaisha Toshiba
InventorsKeizo Shimamura, Kagetaka Amano, Tatsuyoshi Aisaka, Satoshi Hanai, Kohsoku Nagata
Life of this patent
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Abstract
A dispersion strengthened copper alloy containing a copper matrix, and dispersion particles dispersed in the copper matrix within a range of 0.5 to 6 vol %. In this alloy, an average diameter of a matrix region where the dispersion particles are not present is 0.3 .mu.m or less, and the total amount of solid solution elements contained in the copper matrix is determined such that, when this amount of the solid solution elements is added to pure copper, the electric conductivity of the matrix is lowered by 5% IACS or less.
Claims15
A dispersion strengthened copper alloy containing:
- a copper matrix;
- and dispersion particles dispersed in the copper matrix within a range of 0.5 to 6 vol %,
- wherein an average diameter of a matrix region where the dispersion particles are not present is 0.3 .mu.m or less, and the total amount of solid solution elements contained in the copper matrix is determined such that, when this amount of the solid solution elements is added to pure copper, the electric conductivity of the matrix is lowered by 5% IACS or less.
A method of manufacturing a dispersion strengthened copper alloy comprising the following steps:
- mechanically pulverizing and mixing a powder of copper oxide having particle diameters of 5 .mu..mu.m or less, and a raw material having particle diameters of 1 .mu..mu.m or less which is chemically more stable than the copper oxide in a reducing atmosphere, to yield a mixed powder having particle diameters of 0.05 .mu..mu.m or less;
- selectively reducing the copper oxide contained in the resulting mixed powder, while maintaining said mixed powder at a temperature not higher than 1065.degree. C.;
- shaping the selectively reduced mixed powder;
- and
- sintering the shaped body obtained to form a sintered body containing a copper matrix and dispersed particles.
A dispersion strengthened copper alloy produced by a method comprising the following steps:
- mechanically pulverizing and mixing a powder of copper oxide having particle diameters of 5 .mu..mu.m or less, and a raw material having particle diameters of 1 .mu..mu.m or less which is chemically more stable than the copper oxide in a reducing atmosphere, to yield a mixed powder having particle diameters of 0.05 .mu..mu.m or less;
- selectively reducing the copper oxide contained in the resulting mixed powder, while maintaining said mixed powder at a temperature not higher than 1065.degree. C.;
- shaping the selectively reduced mixed powder;
- and
- sintering the shaped body obtained to form a sintered body containing a copper matrix and dispersed particles.
A magnetic field generating coil formed of a dispersion strengthened copper alloy comprising:
- a copper matrix;
- and
- dispersion particles dispersed in the copper matrix within a range of 0.5 to 6 vol %,
- wherein an average diameter of a matrix region where the dispersion particles are not present is 0.3 .mu.m or less, and the total amount of solid solution elements contained in the copper matrix is determined such that, when this amount of the solid solution elements is added to pure copper, the electric conductivity of the matrix is lowered by 5% IACS or less.
A resistance welding electrode formed of a dispersion strengthened copper alloy containing:
- a copper matrix;
- and
- dispersion particles dispersed in the copper matrix within a range of 0.5 to 6 vol %,
- wherein an average diameter of a matrix region where the dispersion particles are not present is 0.3 .mu.m or less, and the total amount of solid solution elements contained in the copper matrix is determined such that, when this amount of the solid solution elements is added to pure copper, the electric conductivity of the matrix is lowered by 5% IACS or less.
A composite superconducting wire comprising:
- a base material formed of a dispersion strengthened copper alloy containing a copper matrix, and dispersion particles dispersed in the copper matrix within a range of 0.5 to 6 vol %, wherein an average diameter of a matrix region where the dispersion particles are not present is 0.3 .mu..mu.m or less, and the total amount of solid solution elements contained in the copper matrix is determined such that, when this amount of the solid solution elements is added to pure copper, the electric conductivity of the matrix is lowered by 5% IACS or less;
- and
- a superconducting core wire buried in said base material.
A high electrical conductivity spring formed of a dispersion strengthened copper alloy containing:
- a copper matrix;
- and
- dispersion particles dispersed in the copper matrix within a range of 0.5 to 6 vol %,
- wherein an average diameter of a matrix region where the dispersion particles are not present is 0.3 .mu.m or less, and the total amount of solid solution elements contained in the copper matrix is determined such that, when this amount of the solid solution elements is added to pure copper, the electric conductivity of the matrix is lowered by 5% IACS or less.
A lead frame formed of a dispersion strengthened copper alloy containing:
- a copper matrix;
- and
- dispersion particles dispersed in the copper matrix within a range of 0.5 to 6 vol %,
- wherein an average diameter of a matrix region where the dispersion particles are not present is 0.3 .mu.m or less, and the total amount of solid solution elements contained in the copper matrix is determined such that, when this amount of the solid solution elements is added to pure copper, the electric conductivity of the matrix is lowered by 5% IACS or less.
Dependencies are inferred from the claim text.