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US 4,996,583 AGranted
Stack type semiconductor package
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorKenzo Hatada
Life of this patent
Estimating the term…
Abstract
In a semiconductor device, an outer lead is divided into plural leads at an outer lead region connected to an inner lead which is connected to an electrode terminal of a semiconductor chip, a plurality of TAB packages on which the semiconductor chip has been packaged are stacked in plural layers, at least one of the plural divided leads every stacked layers is left and a predetermined number of the divided leads are cut out, and these stacked TAB packages are mounted on a circuit board.
Claims5
A semiconductor device, comprising:
- an outer lead region connected to an inner lead which is connected to an electrode terminal of a semiconductor chip, said outer lead region comprising plural divided leads each connected to said inner lead;
- a circuit board;
- a plurality of TAB packages, said semiconductor chip being packaged in said TAB packages, said TAB packages being stacked in plural layers;
- said stacked TAB packages being mounted on said circuit board;
- at least one of said plural divided leads being provided at each of said stacked layers and a predetermined number of said plural divided leads being cut out of each of said stacked layers.
2 more elements
Dependencies are inferred from the claim text.