Process and apparatus for cutting and trimming printed circuit board workpieces

Abstract

This invention relates to a process and an apparatus for cutting and trimming printed circuit board workpieces, particularly printed multilayer circuit board workpieces, which are cut to an exactly predetermined, selectable size at high speed in an operation in which the workpieces are subjected only to relatively low stresses. The workpieces are cut and trimmed and are profiled at each of their edges in a single operation. This is accomplished by means of two circular sawblades, which extend in a common plane and have interdigitating sawteeth, which preferably have diamond cutting edges. The interdigitating sawteeth of the two sawblades cut into the workpiece from opposite broadsides and the sawteeth of each of the sawblades penetrate into the workpiece only in part of its thickness. As a result, the circuit board workpiece is cut and trimmed without a formation of burrs and in the same operation is formed with at its edge portion with a profile that is determined by the profile of those side faces of said sawteeth which face said edge portion.

Dependencies are inferred from the claim text.