Radiation curable pressure sensitive adhesive composition

A radiation curable pressure sensitive adhesive composition comprising:

• (A) 100 parts by weight of a hydrogenated 1,2-polybutadiene liquid oligomer which has one or more ethylenically unsaturated terminal radicals in its molecule and in which 70% or more of intramolecular carbon-carbon double bonds has been hydrogenated, said one or more ethylenically unsaturated terminal radicals being attached at both terminals of a main chain of the hydrogenated 1,2-polybutadiene liquid oligomer and the main chain of the hydrogenated 1,2-polybutadiene liquid oligomer being prepared by living anionic polymerization;
• (B) from 0.2 to 20 parts by weight of a chain transfer agent selected from the group consisting of ethylene glycol bis(thioglycolate), 1,4-butanediol bis(thiopropionate), trimethylolpropane tris(thioglycolate), trimethylolpropane tris(.beta.-thiopropionate), and pentaerythritol tetrakis(.beta.-thiopropionate);
• and
• (C) from 0.001 to 1.0 parts by weight of a thermal polymerization inhibitor selected from metal complexes of N-nitrosophenylhydroxylamine.