Process for hardening ballasts and other heaped structures
AssigneeMesser Griesheim GmbH
InventorsKarl R. Zeiss, Paul Degen
Life of this patent
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Abstract
The process for hardening ballasts and other heaped structures calls for an adhesive, which is pourable at ambient temperatures, to first be transformed into the solid state by means of cooling. Then, the application of the liquid adhesive onto the heaped structure is time-dosed by the thawing of the cooled adhesive.
Claims8
In a process for hardening ballasts and heaped structures by means of an adhesive which is pourable at the ambient temperature, the improvement being in that the adhesive is first transformed into the solid state by means of cooling, and the solid adhesive is applied onto the heaped structure and time-dosed by the thawing of the cooled adhesive.
Dependencies are inferred from the claim text.