Three dimensional plating or etching process and masks therefor

A method for fabricating a mask, comprising in combination the steps of:

• coating one surface of a sheet of transparent vacuum formable material having thickness between 0.005 and 0.050 inch with a vacuum formable ink;
• vacuum forming said sheet;
• and
• removing portions of said ink to reveal transparent areas of said mask by illuminating said portions of said ink with a low power computer controlled YAG laser.

A mask for use in a plating or etching process to be carried out on a workpiece, comprising in combination:

• a vacuum formed sheet of flexible transparent plastic carrying the approximate shape of a surface of said workpiece;
• a coating of an opaque material covering a portion of said sheet;
• at least one area of said sheet having an absence of said opaque material to expose transparent plastic;
• and
• registration means for providing alignment between said mask and said workpiece.

A method for applying a mask to a workpiece for use in a plating or etching process, the method comprising in combination the steps of:

• providing a flexible mask having a surface which conforms with a surface of said workpiece;
• registering said mask over said surface of said workpiece;
• and
• drawing said mask into close contact with said workpiece by applying a vacuum between said mask and said workpiece.

A method for processing a substrate, comprising in combination the steps of:

• coating a plated substrate with photoresist;
• installing a flexible mask over said coated substrate;
• pulling said substrate and said mask into close contact by applying a vacuum between said substrate and said mask;
• and
• exposing said coated substrate to light through said mask.

A method for printing and plating a substrate, comprising the ordered steps of:

• molding an insulative substrate to a predetermined shape;
• annealing said insulative substrate;
• electroless plating said substrate with copper;
• electroplating said substrate with a photoresist material;
• drying and baking said photoresist material;
• installing a flexible mask over said substrate;
• pulling said flexible mask into close registration with said substrate by applying a vacuum between said mask and said substrate;
• exposing said substrate to non-collimated light through said mask;
• removing said mask from said substrate;
• developing said photoresist material to expose areas of plated substrate while covering other areas of plated substrate;
• electroplating said exposed areas of plated substrate with a conductive material;
• etching said other areas of plated substrate to remove said plating on said other areas;
• and
• stripping said photoresist to expose said other areas of plated substrate.

A method for fabricating a mask, comprising in combination the steps of:

• providing a sheet of transparent material which turns opaque when exposed to laser light of adequate intensity;
• forming said sheet of material into a predetermined shape;
• and
• exposing said formed sheet to laser light of adequate intensity to cause selected areas of said formed sheet to turn opaque.

A method for printing and etching a substrate, comprising the ordered steps of:

• molding an insulative substrate to a predetermined shape;
• annealing said insulative substrate;
• electroless plating said substrate with a conductive material;
• electroplating said substrate with a conductive material;
• electroplating said substrate with a photoresist material;
• drying and baking said photoresist material;
• installing a flexible mask over said substrate;
• pulling said flexible mask into close registration with said substrate by applying a vacuum between said mask and said substrate;
• exposing said substrate to non-collimated light through said mask;
• removing said mask from said substrate;
• developing said photoresist material to expose areas of plated substrate while covering other areas of plated substrate;
• etching away said exposed areas of plated substrate;
• and
• stripping said photoresist to expose said other areas of plated substrate.