Component location device and method for surface-mount printed circuit boards
AssigneeSCI Systems, Inc.
InventorsWalter J. Conroy, William Katona
Life of this patent
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AssigneeSCI Systems, Inc.
InventorsWalter J. Conroy, William Katona
Estimating the term…
Electrical circuit components such as integrated circuit chips with plural closely-spaced mounting feet/terminals are mounted on surface-mount connection pads on a printed circuit board very simply and easily by mechanical means. An alignment pattern member having very precisely located holes matching the array of pads on the printed circuit board is used. The feet of the component first are fitted into the holes in the pattern to orient and locate them accurately, then the pattern and the component are separated from one another, and the component is placed with the feet on the pads. Preferably, the component is picked up with a vacuum pick-up device to remove it from the pattern, an is lowered onto the pads of the circuit board by the same mechanism. In an alternate embodiment, the printed circuit board and the pattern are secured to a sliding table which removes the pattern from beneath the vacuum pick-up device and moves a printed circuit board into position underneath the vacuum pick-up devices, which then lower the components onto the pads. Advantageously, the pattern member is made with a stencil used to apply solder paste to the pads.
A device for accurately placing at least one electrical circuit component having at least one mounting foot serving as an electrical lead on a printed circuit board having at least one conductive pad thereon, said pad having an outer peripheral outline with said foot accurately aligned with and contacting said pad with the foot within the outer peripheral outline of the pad,
A method of accurately positioning electrical circuit components having mounting feet on printed circuit boards having mounting pads arranged in an array matching the array of feet on said component, each pad having an outer peripheral outline,
A device for placing electrical circuit components accurately on surface-mount pads on printed circuit boards,
A device for placing electrical circuit components accurately on surface-mount pads on printed circuit boards, said device comprising, in combination,
A device for placing electrical circuit components accurately on surface-mount pads on printed circuit boards, said device comprising, in combination,
A device for accurately locating electrical circuit components on conductive surface-mount pads on a circuit board, said circuit components having legs with pads at the end thereof, said pads on said legs being shaped to match said pads on said board,
Dependencies are inferred from the claim text.