Thermal stencil master sheet and adhesive therefor
AssigneeRiso Kagaku Corporation
InventorsMasaki Bando, Kenichi Sukegawa, Hiromiti Yamada, Mitsutsugu Masuda, Yukio Okada, Mitsuyoshi Yukawa, Nobuyuki Sato
Life of this patent
Estimating the term…
Abstract
A thermal stencil master sheet for stencil printing has a thermoplastic synthetic resin film which is perforatable with heat and a porous substrate, which is substantially unchanged by the heat. The film is bonded to the substrate with a urethane adhesive, preferably composed mainly of a specific urethane prepolymer obtained by reacting a polyether diol with a diisocyanate so as to give an equivalent ratio of NCO/OH of at least 1.1.
Claims4
A thermal stencil master sheet for stencil printing, comprising a thermoplastic synthetic resin film that is perforatable with heat, and a porous substrate that is substantially unchanged by the heat, said film being bonded to a surface of said porous substrate with a urethane adhesive consisting essentially of a urethane prepolymer obtained by reacting a polyether diol with a diisocyanate so as to give an equivalent ratio of NCO/OH of at least 1.1
A thermal stencil master sheet for stencil printing, comprising a thermoplastic synthetic resin film that is perforatable with heat, and a porous substrate that is substantially unchanged by the heat, said film being bonded to a surface of said porous substrate with a urethane adhesive wherein said urethane adhesive consists essentially of a urethane prepolymer obtained by reacting a polyether diol having a number average molecular weight of 400 to 2,000 with a diisocyanate so as to give an equivalent ratio of NCO/OH of 1.5 to 2.0 and has a flow temperature after curing thereof of 150.degree.-260.degree. C.
Dependencies are inferred from the claim text.