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US 4,954,480 AGranted
Multi-layer superconducting circuit substrate and process for manufacturing same
AssigneeFujitsu Limited
InventorsYoshihiko Imanaka, Takato Machi, Kazunori Yamanaka, Hiromitsu Yokoyama, Nobuo Kamehara, Koichi Niwa
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Abstract
A multi-layer superconducting circuit substrate, including insulating layers, and interconnection patterns of a superconductive ceramic material located between the insulating layers, the patterns of the superconductive ceramic material being connected via through-holes of the superconductive ceramic material, is provided. The patterns of the superconductive ceramic material are preferably encapsulated with a metal of gold, silver, platinum or an alloy thereof.
Claims4
A multi-layer substrate, comprising:
- a plurality of insulating layers laminated into a multi-layer structure, the insulating layers being fired and having holes penetrated therethrough;
- interconnection layers of an oxide superconductive ceramic material located between the insulating layers, said superconductive, interconnection layers being fired,
- wherein said plurality of insulating layers is made of a glass-ceramic material fired at a temperature lower than a temperature for firing the superconductive interconnection layers;
- superconductive ceramic material filling said holes of said insulating layers and electrically connecting said interconnection layers;
- and
- a metal layer encapsulating the interconnection layers of the superconductive ceramic material, the metal of the metal layer being selected from the group of gold, silver, platinum and an alloy thereof.
3 more elements
Dependencies are inferred from the claim text.